Meiko Electronics Company, Ltd.

Financial

Technology Road Map

B²it Technology Bump Interconnection		2004	2005	2006	2007
	L/S	75/50um	40/40um	30/30um	20/20um
	Land diameter	300um	275um	250um	200um
	Bump Diameter	150um	130um	100um	80um
	Insulation Thickness	60um	<<<	<<<	<<<
			40/100/ 150um	<<<	<<<

CSP terminal pitch >

0.5mm pitch

0.4mm pitch

0.3mm pitch

M-Via Technology Laser Technology		2004	2005	2006	2007
	L/S	75/75um	50/50um	40/40um	30/30um
	Land diameter	275um	250um	200um	200um
	Bump Diameter	125um	100um	75um	50um
	Insulation Thickness	40um/ 60um	<<<	<<<	<<<