Meiko Electronics to Mass-Produce High-Density Circuit Boards

Saturday, April 16, 2005 TOKYO (Nikkei)--Meiko Electronics Co. (6787) has decided to mass produce in Japan high-density cutting-edge circuit boards used in third-generation mobile phone handsets.

By next year, the company will spend a total of 7.5 billion yen to build a new plant in Ishinomaki, Miyagi Prefecture, for circuit boards with 20- to 40-micron linewidths. The new plant will be constructed at a production subsidiary Meiko purchased for 1.9 billion yen in January. The 6,700 sq. meter facility will be built by August and will be placed into service in October.

Both 40-micron circuit boards for mounting electronic components for mobile phones and 20-micron circuit boards for mounting semiconductors for personal computers will be produced at the plant, which will have a monthly production capacity of 20,000 sq. meters.

Meiko has focused until now on investment in mass production sites in China, but decided to switch to domestic investment because of growing demand for cutting-edge products requiring higher density circuit boards.

(The Nihon Keizai Shimbun Saturday morning edition).

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