Printed Circuit Board

CAPABILITIES

• Double-sided

• Multi-layer

• IVH multi-layer

• Flex-rigid

• HDI multi-layer

• Any-layer stack construction HDI

• Package module

FACLILTIES

• JAPAN

  • Kanagawa

  • Yamagata

  • Fukushima

  • Miyagi

• CHINA

  • Guangzhou

  • Wuhan

• VIETNAM

  • Vietnam

Engineering

• Electronic Equipment

• Development

• Quality Assurance

• Environmental Activity