Printed Circuit Board

HDI multi-layer PCBs

HDI multi-layer PCBs are made by placing a conductive pattern on an insulator and then stacking boards to create a multi-layer structure. Since circuitry can be placed even on top of the interlayer connectors, a denser circuit and component mounting pattern is possible. HDI multi-layer PCBs are used in products where high circuit density is required with limited space. Primary applications are mobile phones, digital still and video cameras, DVD players, and notebook PCs.