Printed Circuit Board

Any-layer stack construction HDI PCBs

Meiko developed its exclusive any-layer stack construction HDI PCB by using laser technology. This yields finer circuit patterns, (B2it technology*), producing boards that are even thinner and have other advanced techniques. With these PCBs, circuitry can be placed on the holes, which connect different layers of multi-layer boards where design flexibility is greater. Due to its higher pattern density and other benefits, this PCB is ideal for applications requiring boards that are compact and thin.

(*)B2it (Buried Bump interconnection technology)
This is one of the conductive paste connection build up methods that is used to make multi-layer boards. Conical bumps made of a conductive paste are placed on the copper pattern on a PCB. Next, prepreg (an adhesive) is physically injected to fill the holes, to connect the upper and lower boards. This technique
produces extremely fine circuit patterns.