Meiko stands as a trusted global partner in advanced printed circuit board design, manufacturing, and assembly.
With a distinguished legacy of manufacturing excellence, our expertise supports the technologies that enable next-generation communication, mobility, and intelligent systems.
As electronic designs evolve toward higher density and performance, we are driving capability advancement in 0.35mm pitch CSP applications, mSAP processes, and other cutting-edge interconnect technologies. These strategic initiatives ensure our readiness to support the most advanced circuit architectures in the GSM and broader electronics ecosystems.